Rethinking the operation could unlock more productivity, and the key to successful automated reverse packaging hinges on ...

Oliver Campbell, Dell Technologies’ Director of Procurement & Packaging Engineering, has been with the tech innovation vanguard for more than half the company’s 39-year existence. At that time, the ...

Although consumers care about the products they buy, the packaging matters, too. It is a similar concern for company leaders. An insufficient package could result in goods arriving spoiled, broken or ...

One of the most expensive mistakes in product development is waiting to engage packaging engineering until after the product ...

Products still arrive broken, dented, or unsellable because packaging is often designed for ideal conditions rather than real ...

Investments in automation and additional tools for data analytics keep coming to packaging lines as plants become more connected. Machine learning and digital twin technology are increasing throughput ...

Genesis learns art and engineering are a “package deal” with Packaging Engineer Camille Corr Chism! Genesis joins professor Camille Corr Chism at Michigan State University’s School of Packaging, where ...

This concentration is designed to equip practitioners with the tools necessary to meet tomorrow’s challenges concerning packaging and its sustainability in the associated supply chains. To this end, ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced ...

The Packaging Science and the Graphic Media Science and Technology (GMST) departments at Rochester Institute of Technology will merge, as part of the continuing strategic growth of RIT’s College of ...

Number of options for adding more features into chips grows beyond just 2.5D and 3D as mainstream packaging technologies run out of steam. Apple, Samsung and others are developing the next wave of ...